Complex BGA & FPGA
Assembly Services
From 0.25mm fine-pitch to heavy ceramic packages. Every board receives comprehensive X-Ray inspection for hidden joint defects.
Submit Gerber for ReviewEngineering Capabilities
Advanced equipment and proven processes for the most demanding BGA and FPGA assemblies.
| Feature | Specification |
|---|---|
| Min Pitch | 0.25mm (Ultra-Fine Pitch) |
| Min Ball Diameter | 0.15mm |
| Package Types | BGA, uBGA, CGA, LGA, QFN, POP (Package on Package) |
| Placement Accuracy | ±0.025mm (IC) |
| Max Component Height | 25mm |
We See What Others Can't
Hidden solder joints are the biggest risk in modern electronics. We employ high-resolution X-Ray inspection for every BGA board, not just a random sample.
Good Joint
Uniform ball size, circular shape, no voids or bridging detected.
Defective Joint
Voiding >25% or bridging detected. Board rejected before shipment.
Key Metrics We Monitor
Void Percentage
Strictly kept under IPC Class 2 (or Class 3 upon request) limits.
Head-in-Pillow
Detecting open joints caused by warping or insufficient reflow.
Short Circuits
Bridging detection between fine-pitch pads prevents field failures.
Your Safety Net: Precision Rework
Expensive FPGAs shouldn't be scrapped due to a design change or prototype error. Our optical-alignment rework stations allow us to:
- Desolder and remove the BGA safely without damaging the PCB
- Clean and re-dress the pads to original specifications
- Reball and replace the component with precision alignment
BGA Assembly in Action
High-Density FPGA Board
Multi-layer board with 0.4mm pitch BGA FPGA and 200+ fine-pitch components. Achieved zero defects across 500-unit production run with 100% X-Ray inspection.
Challenge Solved
Warpage control on 12-layer HDI board, achieving <0.5% void ratio
Medical Device Controller
IPC Class 3 assembly with ceramic BGA and POP (Package-on-Package) memory. Full traceability and documentation per ISO13485 requirements.
Challenge Solved
POP assembly with conformal coating, maintaining <3% void on all joints
Have a BGA or FPGA Design?
Let's Review It Before Assembly
Upload your Gerber files and BOM. Our engineers will provide a free DFM review within 24 hours.
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